Published online by Cambridge University Press: 10 February 2011
A direct-write approach to fabricate high precision resistors is reported. Special attention is paid to the effect of print thickness on the resistance value of buried resistors after a low temperature co-firing process. The results show that the direct-write approach provides a superior line definition and thickness control over a traditional screen printing process. Microstructural analysis indicates that there is an interdiffused layer developed between the resistor material and the low temperature co-fired ceramic substrate. These observations are consistent with electrical measurements which show that resistance increases as the effective cross-sectional area is reduced. The resistance data show that the standard deviations for resistors printed on a 6” × 6” area are 5% and 15% for the direct-write and the screen-printed patterns, respectively.