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Copper Corrosion in Irradiated Environments. the Influence of H202 on the Electrochemistry of Copper Dissolution in Hcl Electrolyte

Published online by Cambridge University Press:  28 February 2011

W. H. Smyrl ,
R. T. Bell ,
R. T. Atanasoski  and
R. S. Glass
W. H. Smyrl
Affiliation:
University of Minnesota, Department of Chemical Engineering and Materials Science and Corrosion Research Center, Minneapolis, MN 55455
R. T. Bell
Affiliation:
University of Minnesota, Department of Chemical Engineering and Materials Science and Corrosion Research Center, Minneapolis, MN 55455
R. T. Atanasoski
Affiliation:
University of Minnesota, Department of Chemical Engineering and Materials Science and Corrosion Research Center, Minneapolis, MN 55455 Institute of Electrochemistry ICTM, University of Belgrade, Belgrade, Yugosl avi a
R. S. Glass
Affiliation:
Lawrence Livermore National Laboratory, P.O. Box 808, Livermore, CA 94550
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Abstract

The anodic dissolution of copper has been examined in deaerated, 0.1 M HCl aqueous solution in the presence of H202. Concentrations of H202 up to 0.2 M were studied at a rotating copper disk-platinum ring electrode. The open circuit potential (OCP) of copper was found to depend on both peroxide concentration and rotation rate. The OCP shifts towards more positive values with increasing H202 concentration (C) and decreasing rotation rate (ω). The dependence of OCP on (C/ω1/2) was the same s for oxygenated solutions reported earlier [1], at small values of (C/ω1/2). At higher values of (C/ω1/2), departure from the expected behavior was observed. The current- voltage curves for anodic dissolution of copper were also influenced by the presence of peroxide. The curves recorded with the potential scanned in the positive direction showed the expected 60 mV slope, but the reverse scans showed significant departures. At a given potential scan rate, hysteresis was observed which was larger for higher H202concentrations, lower rotation rates, and more positive anodic potential limits. Monitoring the cuprous ions at the outer Pt ring revealed that there was a complex set of events taking place at the copper surface, including film formation and the appear- ance of cupric ions.

Keywords

RadiationHydrogen PeroxideWaste ManagementCopperCorrosion
Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 84: Symposium L – Scientific Basis for Nuclear Waste Management X , 1986 , 591
Copyright
Copyright © Materials Research Society 1987

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References

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