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Comparison of Cosi2- and Tisi2-Polycide Interconnections Tested by Conventional and High Accelerated Reliability Tests

Published online by Cambridge University Press:  25 February 2011

Dirk Depta  and
Ingo Hollenbeck
Dirk Depta
Affiliation:
Universität Hannover, Institut für Halbleitertechnologie und Werkstoffe in der Elektrotechnik, Appelstraβe 11 A, 30617 Hannover, Germany
Ingo Hollenbeck
Affiliation:
Universität Hannover, Institut für Halbleitertechnologie und Werkstoffe in der Elektrotechnik, Appelstraβe 11 A, 30617 Hannover, Germany
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Abstract

Based on 2μm-wide CoSi2-n+- and TiSi2-n+-polycide structures with a l00nm-thick silicide and a standard AlSi-metallization a comparison between conventional and the high accelerated SWEAT-test was carried out. Supported by simulations different parameters (e.g. activation energie EA) were determined by time-to-failure-measurements. Because of comparable results out of both different tests the SWEAT-test will be prefered due to short time-to-test. Also it will be shown that both silicide systems have an about three times higher activation energy for the inducing of EM-based “open”-failures than the tested standard AlSi-metallization. The failure-rate was less than 100 FIT for both polycides but because of process advantages the CoSi2-polycide should be a promissing metallization to improve the reliability of single and/or multilevel-metallization.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 337: Symposium B – Advanced Metallization for Devices and Circuits—Science, Technology and Manufacturing III , 1994 , 495
Copyright
Copyright © Materials Research Society 1995

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References

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