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Published online by Cambridge University Press: 31 January 2011
Memory properties of nickel silicide nanocrystal monolayers embedded in silicon dioxide have been investigated. The nanocrystal layers were produced by thermal annealing of a sandwich structure comprised of ultrathin Ni film (0.2 nm) sandwiched between two silicon-rich oxide (SiO1.57) layers. Average diameter and areal density is about 2.9 nm and 1.3×1012 cm-2, respectively. Capacitance-voltage (C-V) measurements are shown to have C-V characteristics suitable for nonvolatile memory applications, including large memory window (∼ 10 V), long retention time ( > 107 s), and excellent endurance ( > 106 program/erase cycles).