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Ceramics in Microelectronics Packaging: Past, Present and Future

Published online by Cambridge University Press:  21 February 2011

Rao R. Tummala
Rao R. Tummala*
Affiliation:
IBM East Fishkill, Route 52, Hopewell Junction, NY 12533
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Abstract

A broad review of ceramics in microelectronics for processing, storing, transferring, printing, and displaying information is highlighted. Ceramic packaging is presented with a review of the history, evolution, and state of the art. The recent developments in ceramics resulting in potentially improved thermal and electrical properties by the use of SiC, AIN, and glass±ceramics are discussed. The scientific understanding necessary to support these developments is mentioned.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 154: Symposium K – Electronic Packaging Materials Science IV , 1989 , 379
Copyright
Copyright © Materials Research Society 1989

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References

1. Tummala, R.R. and Rymaszewski, E.J.; Microelectronic Packaging Handbook, Van Nostrand Reinhold, New York, 1989.Google Scholar
2. Seraphim, D.P., Lasky, R. and Li, C., Principles of Electronic Packaging, McGraw-Hill, New York, 1989.Google Scholar
3. Davis, E.M., Harding, W.E., Schwartz, R.S., and Corning, J.J., ”Solid-Logic Technology: Versatile High Performance Microelectronics,” IBM J. Res. Dev., 8 [2] 102–14 (1964).Google Scholar
4. Lloyd, R.H.F., ”ASLT: An Extension of Hybrid Miniaturization Techniques,” IBM J. Res. Dev., 11, 86–92 (1967).Google Scholar
5. Fox, P.E. and Nestork, W.J., ”Design of Logic Circuit Technology for IBM System 370 Models 145 and 155,” IBM J. Res. Dev., 15, 384–90 (1971).Google Scholar
6. Gedney, R.W., ”Trends in Packaging Technology”; pp.127–29 in 16th Annual Proceedings of Reliability Physics, IEEE, New York, 1978 Google Scholar
7. Stetson, H.W., ”Multilayer Ceramic Technology”; pp. 307–22 in High-Technology Ceramics - Past, Present, and Future, Ceramics and Civilization, Vol. III. The American Ceramic Society, Inc., Westerville, OH 1986.Google Scholar
8. Gyurk, W.J., ”Method of Manufacturing Multilayered Monolithic Ceramic Bodies,” U.S. Pat. No. 3 192 086, 1965.Google Scholar
9. Balde, J.W.; in VLSI and the Substrate Connection, The Technological Trade-Offs of the Package-Board Interface, D. Brown Associates, Flemington, NJ 1986.Google Scholar