Hostname: page-component-54dcc4c588-9xpg2 Total loading time: 0 Render date: 2025-09-12T10:28:18.558Z Has data issue: false hasContentIssue false
  • English
  • Français

Cathodic Arc Deposition of Tetrahedral Amorphous Carbon: Influence of Process Parameters on Microstructure and Hardness

Published online by Cambridge University Press:  10 February 2011

S. M. Camphausen ,
A. F. Myers ,
S. P. Bozeman ,
D. A. Baldwin  and
J. J. Cuomo
S. M. Camphausen
Affiliation:
MTE Department, North Carolina State University, Raleigh, NC 27695
A. F. Myers
Affiliation:
Surface and Microanalysis Science Division, Chemical Science and Technology Laboratory, NIST, Gaithersburg, MD 20899
S. P. Bozeman
Affiliation:
Commonwealth Scientific Corporation, 500 Pendleton St., Alexandria, VA 22314
D. A. Baldwin
Affiliation:
Commonwealth Scientific Corporation, 500 Pendleton St., Alexandria, VA 22314
J. J. Cuomo
Affiliation:
MTE Department, North Carolina State University, Raleigh, NC 27695
Get access

Abstract

The cathodic arc provides a method for depositing extremely hard thin carbon films. These films are potentially useful in a variety of tribological applications including protection of magnetic media and recording heads. Effective application of this technology requires an improved understanding of the influence of process parameters on the microstructure and hardness of the deposited films. In this work, we use a commercially available filtered cathodic arc to deposit tetrahedral amorphous carbon at several deposition angles.

Information

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 498: Symposium AA – Covalently Bonded Disordered Thin-Film Materials , 1997 , 135
Copyright
Copyright © Materials Research Society 1998

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

Article purchase

Temporarily unavailable

References

REFERENCES:

1. Nakhodkin, N.G. and Shaldervan, A.I., Thin Solid films. 10, 109 (1972).Google Scholar
2. Nieuwenhuizen, J.M. and Haanstra, H.B., Phil. Tech. Rev. 27, 87 (1966).Google Scholar
3. Rother, B., Siegel, J., Breuer, K., Muhling, I., Deutschmann, S., Vetter, J., Trommer, G., Rau, B., Heiser, C., Mat. Sci. and Eng., A140, 780 (1991).Google Scholar
4. Cuomo, J.J., Pappas, D.L., Lossy, R., Doyle, J.P., Bruley, J., Di Bello, J.W., Krakow, W., JVST A. 10, 3414 (1992).Google Scholar
5. Dirks, A.G. and Leamy, H.J., Thin Solid films 47, 219 (1977).Google Scholar