Hostname: page-component-745bb68f8f-kw2vx Total loading time: 0 Render date: 2025-02-10T07:26:35.537Z Has data issue: false hasContentIssue false
  • English
  • Français

A Calorimetric Evaluation Of The Peel Adhesion Test

Published online by Cambridge University Press:  15 February 2011

J. L. Goldfarb ,
R. J. Farris ,
Z. Chai  and
F. E. Karasz
J. L. Goldfarb
Affiliation:
Polymer Science & Engineering Department, University of Massachusetts Amherst, MA 01003
R. J. Farris
Affiliation:
Polymer Science & Engineering Department, University of Massachusetts Amherst, MA 01003
Z. Chai
Affiliation:
Polymer Science & Engineering Department, University of Massachusetts Amherst, MA 01003
F. E. Karasz
Affiliation:
Polymer Science & Engineering Department, University of Massachusetts Amherst, MA 01003
Get access

Abstract

Simultaneous mechanical and calorimetric measurements of the work and the heat of peeling have been made for polyester films bonded to rigid metal substrates with a pressure sensitive adhesive. Most of the work expended in peeling is consumed by plastic deformation and viscous dissipation. 70% to 85% of the peel energy is dissipated as heat. The peeled polyester films were tightly curled. Energy stored in the peeled polyester films was measured using solution calorimetry and a significant fraction of the peel energy not dissipated as heat was found to be stored in the peeled films.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 227: Symposium J – Materials Science of High Temperature Polymers for Microelectronics , 1991 , 335
Copyright
Copyright © Materials Research Society 1991

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

REFERENCES

1 Kim, K.S., J. Adhesion Sci. Technol. 3, 175 (1989).Google Scholar
2 Gent, A.N. and Petrich, R.P., Proc. Roy. Soc. A. 310, 433 (1969).Google Scholar
3 Kim, K.S., J. Eng. Mat. & Tech. 110, 266 (1988).Google Scholar
4 Kim, K.S., Mat. Sci. & Eng. A 107, 159 (1989).Google Scholar
5 Gent, A.N. and Hamed, G.R., Polym. Eng. Sci. 17, 462 (1977).Google Scholar
6 Gent, A.N. and Hamed, G.R., J. Appl. Polym. Sci. 21, 2817 (1977).Google Scholar
7 Lyon, R.E. and Farris, R.J., Rev. Ssi. Instrum. 57, 8 (1986).Google Scholar
8 Goldfarb, J.L. and Farris, R.J., to be published (1991).Google Scholar
9 Adams, G.W., The Thermodynamics of Deformation for Thermoplastic Polymers, Ph.D. Thesis (1987).Google Scholar
10 Goldfarb, J.L., (unpublished).Google Scholar