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An Overview of Multichip Module Technology for low Power Applications

Published online by Cambridge University Press:  15 February 2011

Chung W. Ho  and
Sharon McAfee-Hunter
Chung W. Ho
Affiliation:
Digital Equipment Corporation, MicroModule Systems, 10500 Ridgeview Court, Cupertino, CA 95014
Sharon McAfee-Hunter
Affiliation:
Digital Equipment Corporation, MicroModule Systems, 10500 Ridgeview Court, Cupertino, CA 95014
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Abstract

Thin-film multichip modules (i.e. MCM-D) can provide simple, low-cost packaging and interconnect options for interconnecting high-density, high-performance devices. The following is an overview of an MCM-D technology that can be implemented on top of several substrate materials. Tradeoffs will be discussed related to using different substrate materials and the corresponding implications from the assembly point of view. The MCM-D manufacturing process is reviewed and the subsequent reliability results are discussed.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 264: Symposium G – Electronic Packaging Materials Science VI , 1992 , 3
Copyright
Copyright © Materials Research Society 1992

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References

Abbasi, S. et al, “The Technology and Manufacture of the VAX-9000 Multichip Unit,” Digital Technical Journal - February 1992.Google Scholar
Bakoglu, H.B., Circuits, Interconnections, and Packaging for VLSI, Addison-Wesley, Reading, MA, 1990.Google Scholar
Lassen, C.L., “Integrating Multichip Modules into Electronic Equipment,” EPS Conference Proceedings, Marlboro, MA, September 1990.Google Scholar
Ohsaki, T., “Electronic Packaging in the 1900's - A Perspective from Asia,” IEEE Transactions on Components, Hybrids, and Manufacturing Technology, June 1991.Google Scholar
Yang, J., “The Reliability Performance Evaluation of High-Density Thin Film Multichip Substrates,” unpublished Digital Equipment Corporation technical paper, April 1992 Google Scholar