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An Analysis of Surface Temperature Rise at Small Scale Sliding Contacts

Published online by Cambridge University Press:  01 February 2011

Sudipto Ray  and
S. K. Roy Chowdhury
Sudipto Ray
Affiliation:
sudipto@mech.iitkgp.ernet.in, INDIAN INSTITUTE OF TECHNOLOGY, KHARAGPUR, MECHANICAL, TRIBOLOGY LAB, KHARAGPUR, WEST BENGAL, 723102, India, 919434368928
S. K. Roy Chowdhury
Affiliation:
skrc@mech.iitkgp.ernet.in, INDIAN INSTITUTE OF TECHNOLOGY, KHARAGPUR, DEPARTMENT OF MECHANICAL ENGINEERING, India
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Abstract

A great deal of work has been carried out in recent years on temperature rise at the contact between sliding bodies with engineering scale roughness. However, as surfaces become smoother and loading decreases, in applications such as MEMS and NEMS devices, the analysis of surface temperature rise must consider the small-scale asperity height distributions and the surface forces that may be operating at small separations. The paper attempts to predict surface temperature rise at sliding contacts with small-scale roughness considering the influence of relevant parameters. The important observation here is that in addition to the dependence on load, speed and material parameters the contact temperature steadily increases with surface adhesion.

Keywords

thermal conductivitynanoscaleadhesion
Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 890: Symposium Y – Surface Engineering for Manufacturing Applications , 2005 , 0890-Y08-34
Copyright
Copyright © Materials Research Society 2006

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References

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