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Adhesion, Reaction and Stability of Metal/Polyimide Interfaces

Published online by Cambridge University Press:  21 February 2011

J. Kim ,
S. P. Kowalczyk ,
Y. H. Kim ,
N. J. Chou  and
T. S. Oh
J. Kim
Affiliation:
IBM, T. J. Watson Research Center, Yorktown Hleights, NY 10598
S. P. Kowalczyk
Affiliation:
IBM, T. J. Watson Research Center, Yorktown Hleights, NY 10598
Y. H. Kim
Affiliation:
KAIST, Cheong-Ryang P. O. Box 131, Seoul, Korea
N. J. Chou
Affiliation:
IBM, T. J. Watson Research Center, Yorktown Hleights, NY 10598
T. S. Oh
Affiliation:
IBM, T. J. Watson Research Center, Yorktown Hleights, NY 10598
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Abstract

Interfacial reactions of polyimide with several metals have been investigated by XPS and TEM to determine their effects on adhesion and long term stability. It has been found that the polyimide-on-metal interface and the metal-on-polyimide interface are intrinsically different; in the case of PI-on-metal interface, the precursor of polyimide, polyamic acid, reacts with the metal resulting in a strong chemical bond and therefore, higher adhesion strength than the corresponding metal-on-PI interface. Both interfaces are found susceptible to T/H environment, resulting in significant adhesion loss. The mechanical and electrical properties of polyimide may be altered as a result of the interaction with metals and therefore, great care is necessary to insure a stable interface and the reliability of devices.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 167: Symposium K – Advanced Electronic Packaging Materials , 1989 , 137
Copyright
Copyright © Materials Research Society 1990

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