Hostname: page-component-745bb68f8f-b95js Total loading time: 0 Render date: 2025-02-04T14:31:27.372Z Has data issue: false hasContentIssue false
  • English
  • Français

Adhesion of Copper to Polytetrafluoroethylene

Published online by Cambridge University Press:  21 February 2011

Yong-Kil Kim ,
Chin-An Chang ,
A. G. Schrott ,
J. Andreshak  and
M. Cali
Yong-Kil Kim
Affiliation:
IBM Research Division, T. J. Watson Research Center, Yorktown Heights, NY 10598
Chin-An Chang
Affiliation:
IBM Research Division, T. J. Watson Research Center, Yorktown Heights, NY 10598
A. G. Schrott
Affiliation:
IBM Research Division, T. J. Watson Research Center, Yorktown Heights, NY 10598
J. Andreshak
Affiliation:
IBM Research Division, T. J. Watson Research Center, Yorktown Heights, NY 10598
M. Cali
Affiliation:
IBM Research Division, T. J. Watson Research Center, Yorktown Heights, NY 10598
Get access

Abstract

An enhancement of the adhesion between copper and polytetrafluoroethylene (PTFE) has been studied. Thin-films of copper were electron-beam deposited on the surface of the polymer substrates. Peel test measurements showed that, without any treatment of the substrates, the adhesion was poor with a peel strength of 1–2 g/mm. A pronounced enhancement of the adhesion has been obtained when the fluorocarbon substrates were treated by either an ultraviolet (UV) irradiation, an ion-beam presputtering prior to the metal deposition, or heat treatments after the deposition. Among the treatments employed, the ion-beam sputtering was the most effective in improving the adhesion. The roles of the treatments and possible reasons for the enhanced adhesion are discussed in conjunction with the studies of interface morphology and chemistry using Scanning Electron Microscopy, Rutherford Backscattering Spectroscopy, and X-ray Photoelectron Spectroscopy.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 154: Symposium K – Electronic Packaging Materials Science IV , 1989 , 323
Copyright
Copyright © Materials Research Society 1989

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

1. Chang, C.-A., Baglin, J.E.E., Schrott, A.G., and Lin, K.C., Appl. Phys. Lett. 51, 103 (1987).Google Scholar
2. Chang, C.-A., Appl. Phys. Lett. 51, 1236 (1987).Google Scholar
3. Kim, Y.-K., Chang, C.-A., and Schrott, A.G., Submitted to Appl. Phys. Lett., March 1989.Google Scholar
4. Sovey, J.S., J. Vac. Sci. Technol., 16, 813 (1979).Google Scholar
5. Clark, D.T. and Feast, W.J., J. Macromol. Sci. Rev. Macromol. Chem. C12, 191 (1975).Google Scholar
6. Clark, D.T. and Brennan, W.J., J. Electron Spectrosc. Relat. Phenom., 41, 399 (1986).Google Scholar
7. Vogel, S.L. and Schonhorn, H., J. Appl. Polym. Sci., 23, 495 (1979).Google Scholar
8. Wheeler, D.R. and Pepper, S.V., J. Vac. Sci. Technol., A 4, 226 (1982).Google Scholar
9. Kim, Y.-K. and Chang, C.-A., unpublished research, 1989.Google Scholar
10. Schonhorn, H. and Ryan, F.W., J. Adhesion, 1, 43 (1969).Google Scholar
11. Park, J.M., Goldblatt, R.D. and Kim, Y.H., T. Adhesion Sci. Tech., 1, 239 (1987).Google Scholar