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A Study of Sn-Pb-Re Solder

Published online by Cambridge University Press:  15 February 2011

Zhu Ying ,
Fang Hongyuan  and
Qian Yiyu
Zhu Ying
Affiliation:
Postgraduate, Harbin Institute of Technology, Dep. of Welding, Harbin, The People's Republic of China
Fang Hongyuan
Affiliation:
Associate Professor, Harbin Institute of Technology, Dep. of Welding, Harbin, The People's Republic of China
Qian Yiyu
Affiliation:
Professor, Harbin Institute of Technology, Dep. of Welding, Harbin, The People's Republic of China
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Abstract

One of the important way to improve the property of solder joints is to improve the property of solders, This paper is about a study of Sn-Pb-RE solder(RE-Rear Earth, mainly contains Ce and La). It has been shown that the final form of RE in SnPb60/40 solder is Sn-RE intermetallic compound, and a very little RE can change the solder microstructure greatly. The influence of RE on solder life of creep rupture is that Sn-Pn-RE solder has much long life than that of SnPb60/40, and the solder life increases with the increase of RE content.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 323: Symposium J – Electronic Packaging Materials Science VII , 1993 , 137
Copyright
Copyright © Materials Research Society 1994

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