Hostname: page-component-745bb68f8f-l4dxg Total loading time: 0 Render date: 2025-02-04T12:47:50.658Z Has data issue: false hasContentIssue false
  • English
  • Français

Polyimides for Passivation of VLSI Circuits

Published online by Cambridge University Press:  21 February 2011

Maarten A. van Andel  and
Wil F.M. Gootzen
Maarten A. van Andel
Affiliation:
Philips Research Laboratories, P.O. Box 80000, 5600 JA Eindhoven, The Netherlands
Wil F.M. Gootzen
Affiliation:
Philips Research Laboratories, P.O. Box 80000, 5600 JA Eindhoven, The Netherlands
Get access

Abstract

From a processing point of view polyimides are attractive materials for use as interlayer dielectric and as passivation coating on ICs. For plastic encapsulated devices they can also improve on the thermomechanics, thereby enhancing yield and reliability. We simulated the thermomechanical behaviour of such a device with finite element calculations. Based on these simulations the commercial product PIQ-L100 was chosen as a model polyimide to study some important physical and chemical parameters. The results from investigating internal stress, molecular orientation and imidization kinetics can be used to optimize polyimide processing and to obtain the desired coating characteristics.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 154: Symposium K – Electronic Packaging Materials Science IV , 1989 , 183
Copyright
Copyright © Materials Research Society 1989

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

Notes & References

[1] Makino, D., IEEE Electr. Ins. Mag. 4, Nr. 2, 15 (1988)Google Scholar
[2] a) Sato, K., Ilarada, S., Saiki, A., Kimura, T., Okubo, T., Mukai, K., IEEE Trans. Parts. Ilybrid. and Packaging P11p–9, 176 (1973) b) T. Nishida, K. Mukai, T. Inaba, T. Kato, I. Tezuka, N. lorie, Proc. Int. Rel. Phys. Symp. Florida (1985)Google Scholar
[3] Nguyen, L. T., Noyan, L. C., Pol. Eng. Sci. 28, Nr. 16, 1013 (1988)Google Scholar
[4] Molding compounds are composites, and therefore have a complex fracture behaviour. See also: Irwin, G. R., Composite Materials Workshop, edited by Tsai, S. W., Ilalpin, J. C., Pagano, N. J. (Technomic Publishing Co., Stamtbrd, Conn. 1968), Ch. 2Google Scholar
[5] Misawa, Y., Kinjo, N., llirao, M., Numata, S., Momma, N., IEEE Trans. Electron DevicesED23, Nr. 3, 621 (1987). Table I on page 622 of this reference contains an error: kg/cm 2 must be kg/mm 2 in both cases, see also reference [1].Google Scholar
[6] a) Ginsburg, R., Susko, J. R., Proc. 1st Int. Conf. Polyimides, edited by Mittal, K. L. (Plenum Press, New York, 1984), p. 237 b) C. E. Diener, J. R. Susko, Proc. 1st Int. Conf. Polyimides, edited by K. L. Mittal (Plenum Press, New York, 1984)., p. 353Google Scholar
[7] Numata, S., Oohara, S., Fujisaki, K., Imaizumi, J., Kinjo, N., J. Appl. Pol. Sci. 31, Nr. 1, 101 (1986)Google Scholar
[8] Dirass Report E9–6, (Dia Research Institute Inc., Tokyo, 1987), p. 20 Google Scholar
[9] Painter, P.C., Colemann, M.M., Proc. Symp. Pol. Mat. Electronic Packaging and High Technology Applications, edited by Susko, J. R., Snyder, R. W., Susko, R. A. (Electrochem. Soc., Pennington, NJ, 1988), 88–17, 60 Google Scholar
[10] Pryde, C. A., J. Pol. Sci. A: Polymer Chemistry 27, 711 (1989)Google Scholar
[11] PIQ-L100 cured at 350°C was supposed to be fully imidized. See also: Osredkar, R., Microelectron. Reliab. 28, Nr. 4, 599 (1988)Google Scholar
[12] a) Saiki, A., Mukai, K., Ilarada, S., Electronics and Communications in Japan 63–C, Nr. 9, 91 (1980) b) A. Endo, T. Yada, J. Electrochem. Soc. 132, Nr. 1, 155 (1985)Google Scholar
[13] Yokoyama, T., Kinjo, N., Wakashima, Y., Miyadera, Y., IEEE Trans. Electr. Ins. EJ-20, Nr. 3, 557 (1985)Google Scholar
[14] The biphenyl tetracarboxylic acid residue is planar because of conjugation between the carbonyls and the aromatic rings. See also reference [7].Google Scholar
[15] Meijer, E. W., J. Pol. Sci. A: Polymer Chemistry 24, 2199, (1986)Google Scholar