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Non-Destructive Evaluation of Strains and Voiding in Passivated copper Metallizations

Published online by Cambridge University Press:  21 February 2011

Richard P. Vinci ,
Thomas N. Marieb  and
John C. Bravman
Richard P. Vinci
Affiliation:
Department of Materials Science and Engineering, Stanford University, Stanford, CA 94305
Thomas N. Marieb
Affiliation:
Department of Materials Science and Engineering, Stanford University, Stanford, CA 94305
John C. Bravman
Affiliation:
Department of Materials Science and Engineering, Stanford University, Stanford, CA 94305
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Abstract

Stress induced voiding in passivated Cu lines was investigated by x-ray strain analysis and in-situ high voltage scanning electron microscope (HVSEM) techniques. Cu lines on a Ta underlayer and Cu lines on an Al underlayer were patterned by a trilayer liftoff technique and passivated with Si3N4. For direct observation of stress voiding, specimens were heated to 350°C in the HVSEM and then cooled and held at 150°C. Identical samples were subjected to the same thermal cycle for strain state determination using x-ray techniques. The hydrostatic stress state at each temperature was calculated from the measured strains. Few initial voids were observed after passivation in either sample. After heating to 350°C and cooling to the dwell temperature, no new voiding was seen in the Ta/Cu lines. Measured hydrostatic strains were half those measured in the Al/Cu lines. Heavy voiding was observed in the Al/Cu lines after cooling to the dwell temperature.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 309: Symposium M2 – Materials Reliability in Microelectronics III , 1993 , 229
Copyright
Copyright © Materials Research Society 1993

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References

1. Pai, P. and Ting, C., VMIC Conf. Proc., 258 (1989).Google Scholar
2. Ohmi, T. et al. , Int. Elec. Dev. Meeting, 8, (1991).Google Scholar
3. Borgesen, P. et al. , Appl. Phys. Lett., 60(14), 1706, (1992).Google Scholar
4. Nix, W., Met. Trans. A, 20A, 2217, (1989).CrossRefGoogle Scholar
5. Noyan, I. and Cohen, J., Residual Stress, Springer-Verlag, NewYork, NY (1987).CrossRefGoogle Scholar
6. Cullity, B., Elements of X-ray Diffraction, Addison Wesley, Reading, MA (1978)Google Scholar
7. Flinn, P. and Chiang, C., J. Appl. Phys., 67(6), 2927 (1990).CrossRefGoogle Scholar
8. Besser, P. et al. , MRS Symp. Proc., 239, 233, (1992).Google Scholar
9. Follstaedt, D. et al. , MRS Symp. Proc., 225, 225 (1992).Google Scholar
10. Madden, M. et al. , MRS Symp. Proc., 265, 33 (1992).Google Scholar
11. Jones, S. et al. , SPIE Adv. Resist Tech. and Proc., 1086, 555 (1989).Google Scholar
12. Hu, C.-K. et al. , VMIC Conf. Proc., 181 (1986).Google Scholar
13. Holloway, K and Fryer, P., MRS Symp. Proc., 181, 41 (1990).Google Scholar
14. Flinn, P. and Waychunas, G., J. Vac. Sci. and Tech., B6, 1749 (1988).Google Scholar
15. Dieter, G., Mechanical Metallurgy, McGraw-Hill, New York, NY (1986).Google Scholar
16. Bolz, R. and Tuve, G., Handbook of Applied Engineering Science, The Chemical Rubber Co., Boca Raton, FL (1970).Google Scholar
17. Thornton, J., Thin Solid Films,171, 5 (1989).Google Scholar
18. Besser, P., to be presented at Spring MRS Meeting, (1993).Google Scholar
19. Chaudhari, P., J. Vac. Sci. Tech., 9, 520 (1972).Google Scholar
20. Townsend, P., PhD Dissertation, Stanford University, Stanford CA (1987).Google Scholar
21. Flinn, P., J. Mater. Res., 6(7), 1498, (1991).Google Scholar
22. Vinci, R. and Bravman, J., to be presented at Spring MRS Meeting, (1993).Google Scholar