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Mechanical Characteristics of In and Pb5Sn Solders in a Thinfilm Multichip Package

Published online by Cambridge University Press:  25 February 2011

Robert Darveaux ,
Edward Yung ,
Iwona Turlik  and
K.L. Murty
Robert Darveaux
Affiliation:
MCNC, Center for Microelectronics, P.O.Box 12889, RTP, NC 27709-2889
Edward Yung
Affiliation:
MCNC, Center for Microelectronics, P.O.Box 12889, RTP, NC 27709-2889
Iwona Turlik
Affiliation:
MCNC, Center for Microelectronics, P.O.Box 12889, RTP, NC 27709-2889
K.L. Murty
Affiliation:
North Carolina State University, Raleigh, NC 27695-7909
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Abstract

The mechanical properties of the solder joints, in a thin film multichip module, were evaluated using constant deformation-rate, creep and load-relaxation tests in shear mode on specially fabricated samples which are representative of the multichip configuration. While majority of the testing was performed at ambient temperature, a limited amount of study was made to characterize the temperature dependence of the deformation characteristics. Constitutive equations were developed for predicting the deformation behaviors of the solder joints under varied test conditions as well as the in-service reliability of these joints.

Information

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 203: Symposium D – Electronic Packaging Materials Science V , 1990 , 443
Copyright
Copyright © Materials Research Society 1991

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References

REFERENCES

1. Darveaux, R., Hwang, L-T., Reisman, A. and Turlik, I., Thermal Analysis ofa Multichip Package Design, J. Electronic Materials, 18, No.2, 1989, pp 267–274.Google Scholar
2 Darveaux, .R. and Turlik, I., Shear Deformation oflndium Solder Joints, IEEE Proc. I-THERM II, 1990, pp 40–52.Google Scholar
3. Yung, E. K. and Turlik, I., Flip-Chip Process Utilizing Electroplated Solder Joints, IEPS Proc., Marlborough, MA, 1990, pp 1065–1079.Google Scholar
4. Murty, K.L. and Yoon, K.K., Scripta Met. 13, 299 (1979).Google Scholar
5. Sherby, O.D. and Burke, P.M., Mechanical Behavior of Crystalline Solids at Elevated Temperature, Prog. Mat. Sci., 13, 325 (1968).Google Scholar
6. Miller, L.F., Controlled Collapse Reflow Chip Joining, IBM J.Res.Dev., May 1969, vol.13, pp 239–250.Google Scholar