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Material and Interface Characterization of Cu99Ti1 Thin Films Metallized on Polyimide

Published online by Cambridge University Press:  15 February 2011

E. Kondoh  and
T.P. Nguyen
E. Kondoh
Affiliation:
IMEC, Kapeldreef 75, 3001 Leuven, Belgium
T.P. Nguyen
Affiliation:
Institut des Matériaux de Nantes, Laboratoire de Physique Cristalline 2, Rue de la Houssinière, 44322 Nantes Cedex 3, France
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Abstract

Copper films with a small amount of an alloy element (1 wt % Ti) were metallized on polyimide. Plasma pre-treatment of the polyimide surface and post-metallization annealing were used to modify the interface. Interfaces and metal film layers were investigated; a drastic increase in adhesion strength, the suppression of Cu diffusion into polyimide, and the improvement of (111) texture were found. Composition analysis data taken from the interface indicated the accretion of nitrogen at the interface. The formation of Ti-related chemical bonds, suggested by X-ray photoelectron spectroscopy, can explain the above-mentioned experimental results.

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Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 476: Symposium N – Low-Dielectric Constant Materials III , 1997 , 81
Copyright
Copyright © Materials Research Society 1997

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References

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