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Grain-Size Stability and Microhardness of Copper-Fullerene Nanocomposites

Published online by Cambridge University Press:  15 February 2011

R.L. Holtz ,
E.V. Barrera ,
J. Milliken  and
V. Provenzano
R.L. Holtz
Affiliation:
Geo-Centers, Inc., 10903 Indian Head Hwy., Ft. Washington, MD 20744
E.V. Barrera
Affiliation:
Department of Materials Science, Rice University, Houston, TX 77251
J. Milliken
Affiliation:
Chemistry Division, Code 6120, Naval Research Laboratory, Washington, DC 20375
V. Provenzano
Affiliation:
Materials Science and Technology Division, Code 6370, Naval Research Laboratory, Washington, DC 20375
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Abstract

Nanocomposites of copper with low concentrations of dispersed fullerenes were synthesized by simultaneous sputtering of copper and sublimation of fullerenes. Postdeposition heat treatments at 400 and 800 °C were performed to assess the thermal stability of the microstructure and the effect on the Vicker's microhardness. The as-deposited copperfullerene composite has submicron-scale granularity, in contrast to pure copper which has conventional columnar growth. Grain growth in the heat-treated fullerene-containing specimens is suppressed and the microhardness enhanced relative to pure copper.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 351: Symposium V – Molecularly Designed Ultrafine/Nanostructured Materials , 1994 , 375
Copyright
Copyright © Materials Research Society 1994

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References

REFERENCES

1. Ashby, M.F., in Physics of Strength and Plasticity, edited by Argon, Ali S., (Massachusetts Institute of Technology, 1969), pp. 113–131.Google Scholar
2. Rios, P.R., Acta. Metall. 35, 2805 (1987); E. Nes, N. Ryum, and O. Hunderi, ibid. 33, 11 (1985); O. Hunderi, E. Nes, and N. Ryum, ibid. 37, 129 (1989).Google Scholar
3. Hall, E.O., Yield Point Phenomena in Metals and Alloys, (Plenum Press, New York, 1970), pp.36–49.Google Scholar
4. High-Tech Materials Alert, 11 (2), 1 (1994); ibid. 10 (3), 2 (1993); ibid. 10 (8), 2 (1993).Google Scholar
5. Yadav, M., Materials & Electrochemical Research Corporation, Tuscon, Arizona (private communication).Google Scholar
6. Zong, G. et al. , (unpublished, submitted to Mat. Sci. & Eng.).Google Scholar
7. Min, U.-S. and Li, J.C.M., Nanostruct. Mat. 2, 311 (1993).Google Scholar
8. Barrera, E.V., Sims, J., Callahan, D.L., Provenzano, V., Milliken, J., and Holtz, R.L., (accepted for publication in J. Mat. Res., March 1994).Google Scholar
9. Abrefah, J., Olander, D.R., Balooch, M., and Siekhaus, W.J., Appl. Phys. Lett. 60, 1313 (1992).Google Scholar
10. Holtz, R.L. and Provenzano, V., (accepted for publication in Nanostruct. Mat., March 1994).Google Scholar
11. Wasz, M. and Barrera, E.V., (submitted to Scripta Metall., March 1994).Google Scholar
12. Sundar, C.S., Bharathi, A., Hariharan, Y., Janaki, J., Sastry, V. Sankara, and Radhakrishnan, T.S., Solid State Commun. 84, 823 (1992).Google Scholar