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Determination of the Bond Strength of a Metal Coating on a Substrate

Published online by Cambridge University Press:  21 February 2011

Wolfgang Sachse ,
Kwang Yul Kim  and
H. D. Conway
Wolfgang Sachse
Affiliation:
Department of Theoretical and Applied Mechanics, Cornell University, Ithaca, New York - 14853, U. S. A.
Kwang Yul Kim
Affiliation:
Department of Theoretical and Applied Mechanics, Cornell University, Ithaca, New York - 14853, U. S. A.
H. D. Conway
Affiliation:
Department of Theoretical and Applied Mechanics, Cornell University, Ithaca, New York - 14853, U. S. A.
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Abstract

This paper reviews the principles and describes new procedures for determining the bond strength of a metal film on a substrate. Considered are mechanical, electrical, acoustical and thermal measurements. Particular attention is placed on techniques which permit an unambiguous connection to be made between measured quantitites and the parameters by which the adhesive strength of a coating on a substrate can be determined.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 154: Symposium K – Electronic Packaging Materials Science IV , 1989 , 293
Copyright
Copyright © Materials Research Society 1989

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References

[1] Mittal, K. L., “Adhesion Measurement of Thin Films”, Electrocomponent Science and Technology, 3, 21–42 (1976).Google Scholar
[2] Mittal, K. L., “Selected Bibliography on Adhesion Measurement of Films and Coatings”, Journal of Adhesion Science and Technology, 1, 247–259 (1987)Google Scholar
[3] Kuwahara, K., Hirota, H. and Umemeto, N., “Adhesion Measurement in Thin Evaporated Films”, in Adhesion Measurement on Thin Films, Thick Films, and Bulk Coatings, Mittal, K. L., Ed., ASTMSTP 640, Am. Soc. Test. Matls., Philadelphia (1978), pp. 198–207.Google Scholar
[4] Kuwahara, K., Nakahara, S. and Nakagawa, T., in Supplement to Transactions, Vol.9, Japan Inst. Metals, Tokyo (1968), p. 1034.Google Scholar
[5] Krongelb, S., “Electromagnetic Tensile Adhesion Test Method”, in Adhesion Measurement on Thin Films, Thick Films, and Bulk Coatings, Mittal, K. L., Ed., ASTM STP 640, Am. Soc. Test. Matls., Philadelphia (1978), pp. 107–121.Google Scholar
[6] Klinenmaier, O. J. and Dobrash, S. M., “Peel Test for Determining the Adhesion of Electrodeposits on Metallic Substrates”, in Adhesion Measurement on Thin Films, Thick Films, and Bulk Coatings, Mittal, K. L., Ed., ASTM STP 640, Am. Soc. Test. Matls., Philadelphia (1978), pp. 369–390.Google Scholar
[7] Kim, K.-S. and Aravas, N., “Elastoplastic Analysis of the Peel Test”, Intl. J. Solids Structures, 24, 417–435 (1988).Google Scholar
[8] Aravas, N., Kim, K.-S. and Loukis, M. J., “On the Mechanics of Adhesion Testing of Flexible Films”, Matis. Sci. and Eng., A107, 159–168 (1989).Google Scholar
[9] Ahn, J., Mittal, K. L. and MacQueen, R. H., “Hardness and Adhesion of Filmed Structures as Determined by the Scratch Technique”, in Adhesion Measurement on Thin Films, Thick Films, and Bulk Coatings, Mittal, K. L., Ed., ASTM STP 640, Am. Soc. Test. Matls., Philadelphia (1978), pp. 134–157.Google Scholar
[10] Valli, J., Makela, U. and Matthews, A., “Assessment of Coating Adhesion”, Surface Engineering, 2, 49–53 (1986).Google Scholar
[11] Valli, J. and Mäkelä, U., “Applications of the Scratch Test Method for Coating Adhesion Assessment”, Wear, 115, 215–221 (1987).Google Scholar
[12] Dally, J. W. and Riley, W. F., Experimental Stress Analysis, (Second Edition), McGraw- Hill Book Company, New York (1978). Chapt. 4.Google Scholar
[13] Agrawal, D. C. and Raj, R., “Measurement of the Ultimate Shear Strength of a Metal- Ceramic Interface”, Acta Metall., 37, 1265–1270 (1989).Google Scholar
[14] Blech, I. A. and Levi, A. A., “Comments on Aleck's Stress Distribution in Clamped Plates”, Trans. ASME, J. Appl. Mech., 48, 442–445 (1981).Google Scholar
[15] Nutt, G. L., Lai, W., Froeschnert, K. E. and King, W. E., “Measurement of Bond Strength at Metal/Ceramic Interfaces”, Presented at the 1989 Spring Meeting, Materials Research Society, San Diego, CA (1989); UCRL Preprint-100915 (April 1989).Google Scholar
[16] Marshall, D. B. and Evans, A. G., “Measurement of Adherence of Residually Stressed thin Films by Indentation. I. Mechanics of Interface Delamination”, J. Appl. Phys., 56, 2632–2638 (1984).Google Scholar
[17] Rossington, C., Evans, A. G., Marshall, D. B. and Khuri-Yakub, B. T., “Measurements of Adherence of Residually Stressed Thin Films by Indentation. II. Experiments with ZnO/Si”, J. Appl. Phys., 56, 2639–2644 (1984).Google Scholar
[18] Evans, A. G. and Hutchinson, J. W., “On the Mechanics of Delamination and Spalling in Compressed Films”, Int. J. Solids and Structs., 20, 455–466 (1984).Google Scholar
[19] Engel, P. A., “Indentation Debonding Test for Polymer Coatings Adhered to a Substrate”, International Journal of Adhesion and Adhesives, 5, 129–132 (1985).Google Scholar
[20] Conway, H. D. and Thomsin, J. P. R., “The Determination of Bond Strength of Polymeric Films by Indentation Debonding”, J. Adhesion Sci. Tech., 2, 227–236 (1988).Google Scholar
[21] Scruby, C. B., “Quantitative Acoustic Emission Techniques”, in Nondestructive Testing, Vol.8, Sharpe, R. S., Ed., Academic Press, London (1985), pp. 141–210.Google Scholar
[22] Kim, K. Y. and Sachse, W., “Characteristics of an Acoustic Emission Source from a Thermal Crack in Glass”, International Journal of Fracture, 31, 211–231 (1986).Google Scholar
[23] Kim, K. Y. and Sachse, W., “Study of Brittle Fracture by Acoustic Emission from Indentation Cracks”, Materials Science Center Report #6523 (August 1988). In Press: Journal of Applied Physics.Google Scholar
[24] Kim, K. Y., Sachse, W. and Hsieh, P., “Quantitative Study of Fracture by Acoustic Emission from Cracks”, in Advances in Fracture Research, Vol.5, Salama, K., K., Ravi-Chandar, Taplin, D. M. R. and Rao, P. Rama, Eds., Pergamon Press, Oxford (1989), pp. 3185–3196.Google Scholar
[25] Vossen, J. L., “Measurement of Film-Substrate Bond Strength by Laser Spallation”, in Adhesion Measurement of Thin Films, Thick Films and Bulk Coatings, Mittal, K. L., Ed., ASTM STP 640, Am. Soc. Test. Matls., Philadelphia (1978), pp. 122–133.Google Scholar
[26] Cooper, J. A., Dewhurst, R. J. and Palmer, S. B., “The Application of Laser Generated Ultrasound to the Remote Testing of Laminar Defects”, in Ultrasonics International '85: Conference Proceedings, Butterworth Scientific, Ltd., Guildford, Surrey, UK (1985), pp. 207–212.Google Scholar
[27] Thomsen, C., Manis, H. J. and Tauc, J., “Picosecond Acoustics as a Non-destructive Tool for the Characterization of Very Thin Films”, Thin Solid Films, 154, 217–223 (1987).Google Scholar
[28] Kim, K. Y. and Sachse, W., “Thin-Film Acoustics: Line -and Point Source Generation and Testing of Thin Films”, in Progress in Acoustic Emission IV, Yamaguchi, K., Kimpara, I. and Higo, Y., Eds., Jap. Soc. Non-destr. Insp., Tokyo (1988), pp. 98–105; also, J. Acoust. Emission, 8, S170-S174 (1989).Google Scholar
[29] Kim, K. Y. and Sachse, W., “Generation of Elastic Waves from Line -and Point Sources by a High-current Pulse Method”, MSC Report #6530 (August 1988). In Press: J. Acoust. Soc. Am. Google Scholar