Published online by Cambridge University Press: 25 February 2011
Polycarbosilane and polysilazane, precursors of SiC and Si3N4, have been incorporated into the binder system for injection-molded Si3N4-based parts. Property requirements for these precursors as the injection-molding binder are briefly described. The binder removal mechanism is proposed and discussed based on the experimental results. Instead, the gas diffusion effect, rather than fluid wicking, is a key factor. Controlling the thermal decomposition rate of the binder is the key for achieving crack-free dense sintered parts.