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Investigation of thermal transport properties of copper-supported pillared-graphene structure using molecular dynamics simulations

Published online by Cambridge University Press:  18 November 2020

Khaled Almahmoud ,
Thiruvillamalai Mahadevan ,
Jincheng Du ,
Huseyin Bostanci  and
Weihuan Zhao
Khaled Almahmoud
Affiliation:
Mechanical Engineering Department, University of North Texas, Denton, TX76207, USA
Thiruvillamalai Mahadevan
Affiliation:
Materials Science and Engineering Department, University of North Texas, Denton, TX76207, USA
Jincheng Du
Affiliation:
Materials Science and Engineering Department, University of North Texas, Denton, TX76207, USA
Huseyin Bostanci
Affiliation:
Mechanical Engineering Department, University of North Texas, Denton, TX76207, USA
Weihuan Zhao*
Affiliation:
Mechanical Engineering Department, University of North Texas, Denton, TX76207, USA
*
Address all correspondence to Weihuan Zhao at weihuan.zhao@unt.edu
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Abstract

Thermal transport of pillared-graphene structure (PGS) supported on a copper substrate was investigated using equilibrium molecular dynamics. The results show that thermal conductivity along the graphene sheet in Cu-supported PGS ranges between 96.12 and 247.16 W/m K for systems with different dimensions at an interaction strength χ = 1. Thermal conductivity along carbon nanotube was found to range between 22.43 and 30.83 W/m K. The increase of interaction strength between Cu and carbon leads to a general decrease in thermal conductivity of PGS. The simulation results suggest that the thermal conductivity in Cu-supported PGS systems is governed by system geometry and phonon transport.

Type
Research Letters
Information
MRS Communications , Volume 10 , Issue 4 , December 2020 , pp. 695 - 701
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Copyright
Copyright © The Author(s), 2020, published on behalf of Materials Research Society by Cambridge University Press

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