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Published online by Cambridge University Press: 14 December 2015
InP membranes have been bonded oxide mediated onto a patterned and unpatterned Sisubstrate. Indentation is shown to allow local testing on patterned areas. Bothresponses on patterned and unpatterned are compared and placed in reference tooxide free bonded membranes. Delamination of the membrane was observed to dependon the presence of patterns in the Silicon substrate. It occurs when theindenting load reached 55 mN for an oxide mediated bonded unpatterned structureand 42 mN for an oxide mediated bonded patterned one. This is in both casesbelow the value of 80 mN obtained for an oxide free bonded membrane(unpatterned). Weibull analysis of these events yielded a modulus m of magnitude6 to 10, indicating that delamination fracture is relatively predictable with aweaker resistance obtained in patterned oxide mediated bonding. Delamination ofthe membrane is the result of constraint of plastic flow by the InP/Siinterface. Membrane rotation is induced and increases with the indentation load,until it is sufficient to initiate and propagate an interfacial crack.