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Pop-in events induced by spherical indentation in compound semiconductors

Published online by Cambridge University Press:  03 March 2011

J.E. Bradby ,
J.S. Williams  and
M.V. Swain
J.E. Bradby*
Affiliation:
Department of Electronic Materials Engineering, Research School of Physical Sciences and Engineering, The Australian National University, Canberra, ACT 0200, Australia
J.S. Williams
Affiliation:
Department of Electronic Materials Engineering, Research School of Physical Sciences and Engineering, The Australian National University, Canberra, ACT 0200, Australia
M.V. Swain
Affiliation:
Biomaterials Science Research Unit, Department of Mechanical and Mechatronic Engineering, and Faculty of Dentistry, The University of Sydney, Eveleigh, NSW 1430, Australia
*
a) Address all correspondence to this author.e-mail: Jodie.Bradby@anu.edu.au
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Abstract

Details of the elastic–plastic transitions in crystalline compound semiconductors have been examined using spherical indentation. Two cubic (InP and GaAs) and two hexagonally structured semiconductors (ZnO and GaN) have been studied. A series of indentations have been made in each material at a number of different loads. The resulting load–penetration curves exhibited one or more discontinuities on loading (so called pop-in events). The load at which the initial pop-in event occurred has been measured along with the corresponding indenter extension. The elastic and elastic–plastic response of each material to spherical indentation has been calculated and compared with the experiment. By taking the difference between the elastic and elastic–plastic penetration depths, it has been found that the pop-in extension at each load could be predicted for each material. The detailed deformation behavior of each of the materials during indentation has also been discussed.

Keywords

NanoindentationSemiconductorMechanical properties
Type
Articles
Information
Journal of Materials Research , Volume 19 , Issue 1 , January 2004 , pp. 380 - 386
Copyright
Copyright © Materials Research Society 2004

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