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Microstructural studies of Cu brazing on AlN

Published online by Cambridge University Press:  26 November 2012

Chaoxian Cai  and
Janet K. Lumpp
Chaoxian Cai
Affiliation:
Department of Electrical Engineering, University of Kentucky, Lexington, Kentucky 40506-0046
Janet K. Lumpp
Affiliation:
Department of Electrical Engineering, University of Kentucky, Lexington, Kentucky 40506-0046
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Abstract

The microstructures and phase compositions of Cu–Ag–Ti active-metal brazing alloys have been studied by scanning electron microscopy and energy dispersive x-ray spectroscopy to evaluate alloy wetting on AlN and Cu brazing on AlN. Titanium is segregated from the original alloy, and a Ti-rich layer is formed between the brazing alloy and AlN substrate. The alloy components are able to penetrate into the grain boundary of AlN during wetting or brazing, and the interfacial reaction takes place along the grain and outer boundary of AlN. The bonding of brazing alloys to AlN substrate often induces cracks in the AlN side.

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Articles
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Journal of Materials Research , Volume 16 , Issue 3 , March 2001 , pp. 670 - 677
Copyright
Copyright © Materials Research Society 2001

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