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Improved creep resistance in anisotropic silicon nitride

Published online by Cambridge University Press:  31 January 2011

Naoki Kondo ,
Yoshikazu Suzuki ,
Manuel E. Brito  and
Tatsuki Ohji
Naoki Kondo*
Affiliation:
National Industrial Research Institute of Nagoya, Shimo-shidami 2268–1, Moriyama-ku, Nagoya, 463–8687 Japan
Yoshikazu Suzuki
Affiliation:
National Industrial Research Institute of Nagoya, Shimo-shidami 2268–1, Moriyama-ku, Nagoya, 463–8687 Japan
Manuel E. Brito
Affiliation:
National Industrial Research Institute of Nagoya, Shimo-shidami 2268–1, Moriyama-ku, Nagoya, 463–8687 Japan
Tatsuki Ohji
Affiliation:
National Industrial Research Institute of Nagoya, Shimo-shidami 2268–1, Moriyama-ku, Nagoya, 463–8687 Japan
*
a)Address all correspondence to this author.naoki-kondo@aist.go.jp
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Abstract

Tensile creep behavior of silicon nitride with aligned rodlike grains (anisotropic silicon nitride), fabricated by superplastic forging, was investigated at elevated temperatures. Creep rate of the anisotropic silicon nitride was about 1 order of magnitude lower than that of the isotropic one (without forging). The stress sensitivities for the isotropic and anisotropic specimens at 1200 °C were 2.1 and 2.6, respectively, and that for the anisotropic specimen at 1250 °C was 3.6. The grain alignment should cause a remarkable improvement in the creep resistance when a tensile stress is applied along the alignment direction.

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Type
Rapid Communications
Information
Journal of Materials Research , Volume 16 , Issue 8 , August 2001 , pp. 2182 - 2185
Copyright
Copyright © Materials Research Society 2001

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References

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