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Evaluation of a silicon-containing benzocyclobutene thermoset resin as a plasma etch stop

Published online by Cambridge University Press:  31 January 2011

Stephen R. Cain ,
Luis J. Matienzo  and
David W. Wang
Stephen R. Cain
Affiliation:
IBM Systems Technology Division, 1701 North Street, Endicott, New York 13760
Luis J. Matienzo
Affiliation:
IBM Systems Technology Division, 1701 North Street, Endicott, New York 13760
David W. Wang
Affiliation:
IBM Systems Technology Division, 1701 North Street, Endicott, New York 13760
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Abstract

An experimental silicon-containing benzocyclobutene thermosetting resin from DOW has been evaluated for use as a plasma etch stop in packaging applications. The thermal and etch properties of this particular resin (DOW UX-13005.02L) make it suitable for use as an etch stop. Further, a model for in situ laser interferometry is proposed. By applying the model to the laser interferogram, the initial etch rate and amount of material removed before etching ceases may be determined.

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Articles
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Journal of Materials Research , Volume 5 , Issue 8 , August 1990 , pp. 1733 - 1738
Copyright
Copyright © Materials Research Society 1990

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