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Measurement and improvement of the adhesion of copper to polyimide

Published online by Cambridge University Press:  31 January 2011

M. Menezes ,
I. M. Robertson  and
H. K. Birnbaum
M. Menezes
Affiliation:
Department of Materials Science and Engineering and Materials Research Laboratory, University of Illinois, Urbana, Illinois
I. M. Robertson
Affiliation:
Department of Materials Science and Engineering and Materials Research Laboratory, University of Illinois, Urbana, Illinois
H. K. Birnbaum
Affiliation:
Department of Materials Science and Engineering and Materials Research Laboratory, University of Illinois, Urbana, Illinois
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Abstract

A contact angle measurement technique has been used to obtain an estimate of the interfacial energy and thermodynamic adhesive strength between copper and polyimide [pyromellitic dyanhydride oxydianalyn (PMDA-ODA) and p-phenylene biphenyltetracarboinide (BPDA-PDA)]. Values of the strength of adhesion from these contact angle measurements are in reasonable agreement with values calculated using the Girifalco–Good–Fowkes nonpolar interfacial adhesion theory. Based on the surface energy it was predicted and experimentally observed that small copper clusters would embed into the polymer matrix if heated under ultrahigh vacuum conditions at temperatures near Tg of the polymer. Controlled embedding of nanometer clusters was utilized to produce a textured interface, where the partially embedded clusters acted as “nanonails” to anchor a metal overlayer to the underlying polyimide substrate. These nanonails greatly increased the bonding between the copper overlayer and the polyimide, as demonstrated by mechanical debonding studies.

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Articles
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Journal of Materials Research , Volume 14 , Issue 10 , October 1999 , pp. 4025 - 4034
Copyright
Copyright © Materials Research Society 1999

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