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Compact 47 GHz band 32-element CMOS phased array transceiver chip with bidirectional IF phase shifter and IQ mixer

Published online by Cambridge University Press:  07 July 2025

Jun Kobayashi*
Affiliation:
Fujitsu Limited, Kawasaki, KNG, Japan
Toshihiro Shimura
Affiliation:
Fujitsu Limited, Kawasaki, KNG, Japan
Yohei Yagishita
Affiliation:
Fujitsu Limited, Kawasaki, KNG, Japan
Masato Nishimori
Affiliation:
Fujitsu Limited, Kawasaki, KNG, Japan
Yoji Ohashi
Affiliation:
Fujitsu Limited, Kawasaki, KNG, Japan
Yoichi Kawano
Affiliation:
Fujitsu Limited, Kawasaki, KNG, Japan
Toshihide Suzuki
Affiliation:
Fujitsu Limited, Kawasaki, KNG, Japan
*
Corresponding author: Jun Kobayashi; Email: kobayashi_r.jun@fujitsu.com

Abstract

This paper presents a compact, dual-polarized, 32-element, 47 GHz phased array transceiver, fabricated in 55 nm CMOS technology with antenna in package (AiP) technology for 5G communications. The proposed transceiver employs an intermediate frequency (IF) phase-shifting architecture and a facing-up (FU) configuration AiP. The IF phase shifting is realized using a bidirectional IF vector sum phase shifter and IQ mixer with drain bias, achieves less than 1° phase resolution, with rms phase error of 0.047° and rms amplitude error of 0.063 dB. The output third-order intercept point is above +1.0 dBm with Txconversion gain of more than 16.5 dB over the radio frequency ranges from 46 to 49 GHz. To reduce heat concentration from the high integrated phased-array transceiver, a FU AiP-fan-out wafer-level packaging utilizes solder balls mounted on the package as a heat spreader, resulting in a thermal resistance of less than 0.3 K/W. The finalized AiP size is only 12.3 mm × 14.9 mm. Regarding the over-the-air measurement, the proposed transmitter can deliver an equivalent isotropic radiated power of 30.7 dBm with single polarization and demonstrates transmitter error vector magnitude less than 3.9% under 5G NR modulation scheme (256QAM, 100 MHz bandwidth).

Information

Type
Research Paper
Copyright
© The Author(s), 2025. Published by Cambridge University Press in association with The European Microwave Association.

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