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  3. LCP for Microwave Packages and Modules
  • Cited by 5
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    • Publisher:
      Cambridge University Press
      Publication date:
      05 July 2012
      21 June 2012
      ISBN:
      9780511777240
      9781107003781
      DOI:
      https://doi.org/10.1017/CBO9780511777240
      Dimensions:
      (247 x 174 mm)
      Weight & Pages:
      0.68kg, 266 Pages
      Dimensions:
      Weight & Pages:
      • Subjects:
      Engineering, Electronic, Optoelectronic Devices, and Nanotechnology, Circuits and Systems, RF and Microwave Engineering
      Series:
      The Cambridge RF and Microwave Engineering Series
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    Subjects:
    Engineering, Electronic, Optoelectronic Devices, and Nanotechnology, Circuits and Systems, RF and Microwave Engineering
    Series:
    The Cambridge RF and Microwave Engineering Series
    Information

    Book description

    A comprehensive overview of electrical design using Liquid Crystal Polymer (LCP), giving you everything you need to know to get up-to-speed on the subject. This text describes successful design and development techniques for high-performance microwave and millimeter-wave packages and modules in an organic platform. These were specifically developed to make the most of LCP's inert, hermetic, low-cost, high-frequency (DC to 110+ GHz) properties. First-hand accounts show you how to avoid various pitfalls during design and development. You'll get extensive electrical design details in areas of broadband circuit design for low-loss interconnects, couplers, splitters/combiners, baluns, phase shifters, time-delay units (TDU), power amplifier (PA) modules, receiver modules, phased-array antennas, flexible electronics, surface mounted packages, Microelectromechanical Systems (MEMS) and reliability. Ideal for engineers in the fields of RF, microwave, signal integrity, advanced packaging, material science, optical and biomedical engineering.

    Reviews

    'These foremost experts have created a compendium on microwave and millimeter-wave applications of LCP in packaging and modules that is clear and comprehensive, starting with materials science and theory, going through wide-ranging and current practical applications, and even covering all of the practical reliability aspects. Moreover, they have revealed in detail a host of design tricks (such as defected grounds) and advanced circuitry (such as a folded Marchand balun with a broadband even-mode matching network) that can enhance the designer’s arsenal in general. We have here a valuable text for microwave designers at all levels.'

    Ed Stoneham - Stoneham Innovations

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