Crossref Citations
This article has been cited by the following publications. This list is generated based on data provided by
Crossref.
Tsu-Jae King
Howe, R.T.
Sedky, S.
Gang Liu
Lin, B.C.-Y.
Wasilik, M.
and
Duenn, C.
2002.
Recent progress in modularly integrated MEMS technologies.
p.
199.
Espinosa, H. D.
Peng, B.
Prorok, B. C.
Moldovan, N.
Auciello, O.
Carlisle, J. A.
Gruen, D. M.
and
Mancini, D. C.
2003.
Fracture strength of ultrananocrystalline diamond thin films—identification of Weibull parameters.
Journal of Applied Physics,
Vol. 94,
Issue. 9,
p.
6076.
Witvrouw, Ann
Gromova, Maria
Mehta, Anshu
Sedky, Sherif
Moor, Piet De
Baert, Kris
and
Hoof, Chris van
2003.
Poly-SiGe, a superb material for MEMS.
MRS Proceedings,
Vol. 782,
Issue. ,
Gromova, M.
Baert, K.
Van Hoof, C.
Mehta, A.
and
Witvrouw, A.
2004.
The novel use of low temperature hydrogenated microcrystalline silicon germanium (μcSiGe:H) for MEMS applications.
Microelectronic Engineering,
Vol. 76,
Issue. 1-4,
p.
266.
Sedky, Sherif
Baert, Kris
Hoof, Chris Van
Wang, Yi
Biest, Omer Van Der
and
Witvrouw, Ann
2004.
Metal induced crystallization of SiGe at 370°C for monolithically integrated MEMS applications.
MRS Proceedings,
Vol. 808,
Issue. ,
Mehta, A.
Gromova, M.
Rusu, C.
Olivier, R.
Baert, K.
Van Hoof, C.
and
Witvrouw, A.
2004.
Novel high growth rate processes for depositing poly-SiGe structural layers at CMOS compatible temperatures.
p.
721.
Sedky, S.
and
Witvrouw, A.
2005.
Micromachining of pulsed laser annealed PECVD Si/sub x/Ge/sub 1-x/ deposited at temperatures ≤370°C.
p.
487.
Zhang, Xianming
Wang, Chungchien
and
Ding, Jingxiu
2014.
Pulsed laser thermal annealing on stress eliminating of poly-SiGe film used in MEMS.
p.
1.