“Smaller is stronger.” Nanostructured materials such as thin films, nanowires, nanoparticles, bulk nanocomposites, and atomic sheets can withstand non-hydrostatic (e.g., tensile or shear) stresses up to a significant fraction of their ideal strength without inelastic relaxation by plasticity or fracture. Large elastic strains, up to ∼10%, can be generated by epitaxy or by external loading on small-volume or bulk-scale nanomaterials and can be spatially homogeneous or inhomogeneous. This leads to new possibilities for tuning the physical and chemical properties of a material, such as electronic, optical, magnetic, phononic, and catalytic properties, by varying the six-dimensional elastic strain as continuous variables. By controlling the elastic strain field statically or dynamically, a much larger parameter space opens up for optimizing the functional properties of materials, which gives new meaning to Richard Feynman’s 1959 statement, “there’s plenty of room at the bottom.”

Using epitaxy and the misfit strain imposed by an underlying substrate, it is possible to elastically strain oxide thin films to percent levels—far beyond where they would crack in bulk. Under such strains, the properties of oxides can be dramatically altered. In this article, we review the use of elastic strain to enhance ferroics, materials containing domains that can be moved through the application of an electric field (ferroelectric), a magnetic field (ferromagnetic), or stress (ferroelastic). We describe examples of transmuting oxides that are neither ferroelectric nor ferromagnetic in their unstrained state into ferroelectrics, ferromagnets, or materials that are both at the same time (multiferroics). Elastic strain can also be used to enhance the properties of known ferroic oxides or to create new tunable microwave dielectrics with performance that rivals that of existing materials. Results show that for thin films of ferroic oxides, elastic strain is a viable alternative to the traditional method of chemical substitution to lower the energy of a desired ground state relative to that of competing ground states to create materials with superior properties.

This article describes various techniques for applying strain to current and future complementary metal–oxide–semiconductor (CMOS) channels to boost CMOS performance. A brief history of both biaxial and uniaxial strain engineering in planar CMOS technology is discussed. Scalability challenges associated with process-induced uniaxial strain in sub-22 nm CMOS is highlighted in view of shrinking device dimensions and 3D device architecture (such as fin field-effect transistors [FinFETs]). Non-uniform strain relaxation in patterned geometries in tight pitch two- and three-dimensional devices is addressed. A case is made that the future scalable strain platform will require a combination of biaxial strain at wafer level in conjunction with local uniaxial strain. Finally, potential application of strain engineering to advanced III–V metal oxide semiconductor FET channels will be examined.

The evolution of elastic strain engineering in nanostructures and devices requires characterization tools that can be used to not only observe but also quantify the actual strain in a sample, whether this strain is intrinsic or applied. Strain contrast in crystalline samples has always been one of the primary contrast mechanisms used for imaging the microstructure of a material in a transmission electron microscope (TEM). In this regard, TEM is a particularly powerful tool due to its ability to spatially resolve strain information with high precision and spatial resolution. This article reviews the techniques currently available for directly measuring strain in the TEM. Examples are given for measuring strain in semiconductor devices using imaging, diffraction, and holographic techniques. For strain measurement during in situ mechanical testing, two general methods are presented: the conversion of displacement from an actuation device or the direct measurement of strain using image features during deformation.

Elastic strain engineering offers a new route to enable high-performance catalysts, electrochemical energy conversion devices, separation membranes and memristors. By applying mechanical stress, the inherent energy landscape of reactions involved in the material can be altered. This is the so-called mechano-chemical coupling. Here we discuss how elastic strain activates reactions on metals and oxides. We also present analogies to strained polymer reactions. A rich set of investigations have been performed on strained metal surfaces over the last 15 years, and the mechanistic reasons behind strain-induced reactivity are explained by an electronic structure model. On the other hand, the potential of strain engineering of oxides for catalytic and energy applications has been largely underexplored. In oxides, mechanical stress couples to reaction and diffusion kinetics by altering the oxygen defect formation enthalpy, migration energy barrier, adsorption energy, dissociation barrier, and charge transfer barrier. A generalization of the principles for stress activated reactions from polymers to metals to oxides is offered, and the prospect of using elastic strain to tune reaction and diffusion kinetics in functional oxides is discussed.

Deformation is one of the most fundamental aspects of materials. While mechanical failure is an outcome of deformation to be avoided, elastic deformation can have a pronounced and positive impact on materials properties. The effect of elastic deformation becomes even more evident at low dimensions, because at the micro/nanoscale, materials and structures can usually sustain exceptionally high elastic strains before failure. The purpose of this overview is to present a summary of recent progress on elastically strained nanowires and atomic sheets. First, we will demonstrate that nanowires can sustain large elastic strains, and their bending modulus increases exponentially as the nanowire diameter decreases. Second, the elastic strain has been found to significantly modify the electronic structure of semiconductor nano/microwires to induce a metal–insulator transition at room temperature and to efficiently transform the mechanical energy into electricity. These recent developments point to potential future applications based on the elastic strain engineering of nanoscale materials.

The nanogap is possibly the single most important physical entity in surface-enhanced Raman scattering. Nanogaps between noble metal nanostructures deliver extremely high electric field-enhancement, resulting in an extraordinary amplification of both the excitation rate and the emission rate of Raman active molecules situated in the gap. In some cases, the resulting surface-enhancement in the gap can be so high that Raman spectra from single molecules can be measured. Here, we briefly review some important concepts and experimental results on nanoscale gaps for SERS applications.